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HT1 MOA3 S30
HITAG 1 Chip Module
Preliminary Specification Revision 1.1 August 1997
TM
Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
Table of Contents
1 Definitions .............................................................................................................................. 3
1.1 Objective of the Specifications ..................................................................................................................... 3 1.2 Definition of the Chip Module ..................................................................................................................... 3 1.3 Use of the Modules ...................................................................................................................................... 3
2 Specifications ......................................................................................................................... 4
2.1 Mechanical Properties ................................................................................................................................. 4 2.2 Materials ..................................................................................................................................................... 4 2.3 Temperature Range ..................................................................................................................................... 4 2.4 Storage Conditions ...................................................................................................................................... 5 2.5 Delivery Conditions..................................................................................................................................... 5 2.6 Electrical Specifications............................................................................................................................... 6
3 Drawing of the Chip Module HT1 MOA3 S30..................................................................... 7
3.1 Drawing of the Reel..................................................................................................................................... 7 3.2 Module outline suggestion ........................................................................................................................... 8 3.3 Splicing Specification .................................................................................................................................. 9
4 Coil Specifications................................................................................................................ 10 5 Functional Description of HITAG 1 ................................................................................... 12
5.1 Memory Organization................................................................................................................................ 12 5.2 Anticollision.............................................................................................................................................. 13 5.3 Operation Modes and Configuration .......................................................................................................... 14 5.3.1 Modes of Operation............................................................................................................................ 14 5.3.2 Configuration..................................................................................................................................... 14 5.4 Configuration of Delivered HITAG 1 Transponders................................................................................... 17 5.5 Definition of Keys and Logdata ................................................................................................................. 17
6 Quality Inspection ............................................................................................................... 19 7 Characterisation and Test of the Final Transponder......................................................... 20
7.1 Characterisation of the Transponder .......................................................................................................... 20 7.2 Final Test of the Transponder .................................................................................................................... 20
8 Ordering Information.......................................................................................................... 21 HITAGTM is a trademark of Philips Electronics N.V.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
1 Definitions
1.1 Objective of the Specifications
This specification lists the parameters to be fulfilled by the HITAG 1 chip module HT1 MOA3 S30 for contactless smart cards or similar transponders (as e.g. discs).
1.2 Definition of the Chip Module
A chip module is an electronically packaged chip covered with a globe top cap. The HT1 MOA3 S30 is above all used as card module, i.e. for further lamination into contactless smart cards according to ISO 10536.1. So the HITAG 1 chip module HT1 MOA3 S30 is best suited for customers that do not want to spend time with micro assembly and therefore start - e.g. ISO card production - with the HITAG 1 chip module.
1.3 Use of the Modules
The HITAG 1 modules are designed to be connected to a coil and then to be further processed by packaging into a transponder (e.g. lamination into an ISO smart card). Specific processing information for the coil-module connection and packaging is given in the specification. For production of contactless chip cards it is recommended to prepunch card foils to create a recess for the chip module in the card body.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
2 Specifications
2.1 Mechanical Properties
Width 7.55 mm (Proposed Punching Outline) Length 11.75 mm (Proposed Punching Outline) Overall Thickness Film Thickness Bondpad Size for Transponder Coil / Module Interconnection 0.45 mm 0.03 mm 0.16 mm 0.005 mm 1.9 x 3.5 mm Suitable for Welding/Soldering/ Conductive Gluing see also drawing in chapter 3
2.2 Materials
Tape Copper Plating Bond Plating Backside Plating Glob Top 110 m 35 m Ni / Au Ni / Au Filled Epoxy Thermal curing Glass epoxy ED copper Suitable for Al and Au wire bonding
2.3 Temperature Range
Operating Processing -25C to +85C 150C for 30 minutes For packed transponder, depending on type of package at a standard lamination pressure for contactless smart card plastic materials (e.g. PVC, PET, ...) on bond pads on bond pads
Welding Parameters Soldering Parameters
max. 25 ms @ 500 C max. 3 s @ 390 C
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
2.4 Storage Conditions
Temperature Relative Humidity Duration 15 - 30 C 40 - 70 % 1 year
2.5 Delivery Conditions
Delivery Identification Date of ready for shipment, reel numbers, total quantity of good modules with the detail of good modules per reel, order number, product type, no supplier identification on reels, bags and boxes. Chip modules on reel approx. 15.000 to 20.000 pcs. per reel, tape width super 35 mm, pitch 9,5 mm, 2 rows 500 pcs . per bag Order-No. 3322 845 04881
Types of Delivery
single chip modules (bulk goods) Packing and Transport According to documentation "Packing Method Modules (reel)" "Packing Method Modules (singulated)" Bad Module Marking All bad modules (mechanical and electrical faults) must be punched by reject hole for customer Bad positions (reel): <20% Splicing Specifications Tape material: adhes. tape 15,5 +/- 0,7 mm, thermal resistance at <190C by < 100 cN tractive power and < 30 sec. duration. Identification label on the reel and on carton bag: - Product type - Number of the reel - Total number of positions - Number of good positions - Date of sealing (to be checked) - Two batches per reel only - Batchnumber indication (only coded, to be checked)
see drawings chapter 3
see drawings chapter 3
Labeling
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
2.6 Electrical Specifications
Symbol Absolute Maximum Ratings Junction Temperature Input Peak Current Latch up Current ESD Operating Range Temperature Input Threshold Voltage Input Read Voltage Input Write Voltage Demodulator Range
3) 1) 3) 1) 3) 1) 3)
min
typ
max
Comment / Conditions
TJ IINpeak
-55C
140C 30 mA
100 mA 2 kV
MIL-STD 883D, Method 3023 MIL-STD 883D, Method 3015.7, Human Body
TA VIN,TH VIN,RD VIN,WR
-40C 3,1 Vp 3,5 Vp 3,7 Vp
85C 4,2 Vp 4,5 Vp 4,7 Vp
RThJunctionAmbient 30 K/W @ IINpeak = 30 mA start modulation after SETCC read EPROM write EPROM
VDEM_R
2,0 Vp
4,0 Vp
VINHigh - VINLow @ VINHigh = 5,0 Vp 2) T0=8 s, TMOD=6*T0 VINLow 2,0 Vp VINLow 2,0 Vp
Modulator R_MOD linear 3) R_MOD nonlinear
3) 3)
RMODL RMODNL
4,5 k 3,6 k
Resonance Capacitor
CResInit
189 pF
210 pF
231 pF
VIN = 4,0 Vp
EEPROM Write Current Read Current
4) 4)
IW IR Years Cycles 10 100.000
25 A 9 A
VDD = 2,8 V VDD = 2,8 V @ 55C
Data Retention Write Endurance
1) 2)
VIN = VIN1 - VIN2 ... voltage between connection pads VINHigh VINLow TMOD input voltage before modulation input voltage during modulation duration of the modulation
3) 4)
@ Ri = 10 k resistance of measurement equipment tested on silicon level
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
3 Drawing of the Chip Module HT1 MOA3 S30
3.1 Drawing of the Reel
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
3.2 Module outline suggestion
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
3.3 Splicing Specification
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
4 Coil Specifications
The HITAG 1 chip module has to be connected to a coil whose parameters are briefly described in the following.
Equivalent circuit of the transponder
Xpc
Rpc
Cp
Uc
Cchip
Rchip
Uc fres Xpc Rpc Cp Cchip Rchip fresc Lpc Lpc Cchip Rpc fresc
... ... ... ... ... ... ... ... = = = > >
voltage at the connection pads resonant frequency of the transponder parallel reactance of the coil (f = 125 kHz) parallel resistance of the coil (f = 125 kHz) parasitic capacitance of the package capacitance of the chip (Uc > 4 Vpp) resistance of the chip self resonant frequency of the coil Xpc/2f (f = 125 kHz) 7.72 mH x % (Cp = 0, x depends on the coil production process) 210 pF 10 % 45 k[ 750 kHz
Note: The parasitic capacitance of the package (Cp) must be considered. fres = 1 1 = 125 kHz L pc = 2 2 (Cchip + Cp).Lpc (2fres ) Cchip + C p
(
)
Typical values for Cp hot laminated cards: moulded tags:
Cp = 1.5 pF Cp = 6.0 pF
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
For a rough estimation ( 10 %) of the number of coil windings following formula can be used. It is assumed that the winding is done in circular form.
N=
L
1 ,8 5
2 U ln (
u ) d
N L U d u
... Number of windings ... Inductance [nH] ... average coil circumference [cm] ... copper diameter [mm] ... average coil circumference [mm]
For fine tuning a measurement of the inductance and an according adjustment of the number of windings is necessary. This process always needs some iterations.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
5 Functional Description of HITAG 1
5.1 Memory Organization
The 2 kBit EEPROM memory on the transponder is divided into 16 blocks. Every block consists of 4 pages. A page is the smallest access unit. Every page consists of 4 bytes (at 8 bits). Block access is only available for Blocks 2-15, page access is available for Pages 0-63.
Block 0 Block 1 secret secret or public user data Block 4 user data Block 7 Block 8
r/w or
OTP
public Serial Number Configuration Key A wo or 0 Key B secret Logdata 1B r/w Logdata 0A or Logdata 1A 0 Logdata 0B
ro r/w wo OTP 0 read only read/write write only one time programmable neither read nor write
public
user data
r/w
Block 15
Configuration of the memory is done in the configuration page
Areas (or settings) with light dark background may be configured by the OEM client using the Configuration Page (Page 1). Memory locations marked with "secret" can only be accessed after a mutual authentication. An enciphered data communication is used in that area. Memory locations marked with "public" can be accessed without mutual authentication, no encryption is used. Block 0 includes the unique serial number (programmed during the production process), the Configuration Page (configuration of the memory area) and the keys, Block 1 includes the logdata.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
Blocks 4 to 7 can be used either as secret or public areas (configurable), and Blocks 2 to 7 either as read / write or read only areas (configurable). You can also modify keys and logdata and prevent them from being accessed. Finally the Configuration Page itself can be set to read only. It is extremely important to be particularly careful when using the Configuration Page (it only can be set to read only once!), keys and logdata as you can lose access to the secret area on the transponder in case of a mistake. ATTENTION: Changing of the Configuration Page (Page 1), Keys and Logdata must be done in secure environment. The transponder must not be moved out of the communication field of the antenna during programming! We recommend to put the transponder close to the antenna (zero-distance) and not to remove it during programming.
5.2 Anticollision
Anticollision Mode in long range applications including HITAG 1 transponders permits you to process several transponders simultaneously. Theoretically up to 232 transponders can be processed simultanously. In practice this number is limited, because of the mutual influence of the transponders - they detune each other, if there are too many too close to each other. The currently used read/write device must also support full anticollision feature (e.g. HTRM800). For read/write devices without that feature only one transponder is handled even if there are several transponders within the communication field of the antenna. In this case either no communication takes place or the "stronger" or closer transponder takes over. By muting a selected transponder (HALT Mode) another transponder that is to be found in the communication field of the antenna can be recognized.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
5.3 Operation Modes and Configuration
5.3.1 Modes of Operation
The HITAG 1 can be operated in two modes (Standard Protocol Mode, Advanced Protocol Mode) that cannot be configured using the Configuration Page, but via special host commands. Advanced Protocol Mode is not available for HITAG 1 transponders based on ASIC HT1 ICS30 01x (only available for HITAG 1 transponders based on ASIC HT1 ICS30 02x) and uses, above all, an additional Cyclic Redundancy Check (CRC) for read operations.
5.3.2 Configuration
The Configuration Page consists of 4 Configuration Bytes, the first two bytes are used for configuration, the other two bytes can be used freely. The bitmaps in Configuration Bytes 0 and 1 determine the configuration of the memory, i.e. they define which area is secret or public, read/write, read only, write only or neither read nor write. You can allocate and write the Configuration Page until it is locked (Bit 4 of Configuration Byte 1 is set to `0'). After that these bytes are read only bytes and the configuration of the transponder memory cannot be changed any more. ATTENTION: Once set to read only the Configuration Page cannot be changed back to read/write again (transponder is hardware protected)! Configuration Bytes 2 and 3: These two bytes, too, are set to read only by the OEM Lock Bit (Configuration Byte 1 / Bit 4 = "0"). Considering that fact you can use these two bytes freely. They will not affect memory configuration. Explanations of abbreviations used: r/w ro wo 0 read and write read only write only neither read nor write
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
Configuration Byte 0: 76543210
Block 7: "1" ... r/w "0" ... ro Block 6: "1" ... r/w "0" ... ro Block 5: "1" ... r/w "0" ... ro Block 4: "1" ... r/w "0" ... ro Block 3: "1" ... r/w "0" ... ro Block 2: "1" ... r/w "0" ... ro Key A and Key B: Logdata A and B: "1" ... wo "0" ... 0 "1" ... r/w "0" ... 0
Configuration Byte 0 / Bit 7:
Bit 7 = `1': Logdata can be read and written to. Bit 7 = `0': Logdata cannot be accessed. This bit can be set or reset until Bit 4 of Configuraion Byte 1 is set to `0'. For further information on Logdata and Keys see chapter "Definition of Keys and Logdata".
Configuration Byte 0 / Bit 6:
Bit 6 = `1': Keys can only be written to. Bit 6 = `0': Keys cannot be accessed. This bit can be set or reset until Bit 4 of Configuration Byte 1 is set to `0'. For further information on Logdata and Keys see chapter "Definition of Keys and Logdata".
Configuration Byte 0 / Bits 0 ... 5:
If one of these Configuration Bits is `1', the corresponding block of the transponder can be read and written. If the bit is set to `0', the corresponding block can only be read. Within one block the configuration is always identical, that means either all 4 pages are read/write or all of them are read only. These bits can be set or reset until Bit 4 of Configuration Byte 1 is set to `0'.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
Configuration Byte 1: 76543210
Access type for Blocks 4 to 7: "0" ... SECRET "1" ... PUBLIC reserved reserved reserved OEM Lock Bit: "0" ... Configuration Page is ro "1" ... Configuration Page is r/w reserved reserved reserved
Configuration Byte 1 / Bits 5 ... 7:
These three bits are reserved. ATTENTION: When writing a new value to Configuration Byte 1, bit positions marked as "reserved" must not be altered. To meet that condition read the current Configuration Byte 1 value and mask in your new values for bit positions you are allowed to change.
Configuration Byte 1 / Bit 4:
Bit 4 = `1': Configuration Page can be read and written to. Bit 4 = `0': Configuration Page can only be read. This process is irreversible ! ATTENTION: Do not set Bit 4 of Configuration Byte 1 to `0' before having written the final data into the Configuration Page of the transponder.
Configuration Byte 1 / Bits 1 ... 3:
These three bits are reserved. ATTENTION: When writing a new value to Configuration Byte 1, bit positions marked as "reserved" must not be altered. To meet that condition read the current Configuration Byte 1 value and mask in your new values for bit positions you are allowed to change.
Configuration Byte 1 / Bit 0:
Bit 0 = `0': Access type for Blocks 4 to 7 is SECRET. Bit 0 = `1': Access type for Blocks 4 to 7 is PUBLIC. This bit can be set or reset until Bit 4 of Configuration Byte 1 is set to `0'.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
5.4 Configuration of Delivered HITAG 1 Transponders
HITAG 1 transponders are delivered with the following configuration by Philips Semiconductors: Unique Serial Number: Serial Number: Configuration Byte 0: Logdata: Key A, Key B: Blocks 2 - 7: Configuration Byte 1: OEM Lock Bit: Blocks 4 - 7:
Read Only
-
fixed
`1' = r/w `1' = wo `1' = r/w
-
can be changed can be changed can be changed
`1' = Configuration Page is r/w `1' = public
-
can be changed can be changed
Value for Transport Keys, Transport Logdata: 0x00000000 RECOMMENDATION: Before delivering transponders to end users, the Configuration Page should be set to read only (Configuration Byte 1/Bit 4 = `0').
5.5 Definition of Keys and Logdata
In order to be able to read data from the secret area of a transponder, you have to carry out a procedure called authentication. To do this you need special data (keys). After transmitting the according command the authentication is automatically carried out by the read/write device. Keys are cryptographic codes, which determine data encryption during data transfer between read/write device and transponder. Two keys (Key A and Key B) which you can use independently of each other, have been installed for security and flexibility reasons. The identity of either Key A or Key B on the read/write device and on the transponder is sufficient. Logdata represent "passwords" needed to gain access to secret areas on the transponder. A pair of logdata is included with every cryptographic key (Key A and Key B). This logdata pair has to be identical both on the transponder and the read/write device. ad Key A: Logdata 0 A "Password" which the transponder sends to the read/write device and which is verified by the latter. "Password" which the read/write device sends to the transponder and which is checked for identity by the latter.
Logdata 1 A
ad Key B:
Logdata 0 B and Logdata 1 B
analogous to Key A
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
It is important that the following values are in accordance with each other, i.e. the respective data on the read/write device and on the transponder have to be identical pairs: on the on the read/write transponder device KEY A KEY A LOGDATA 0A LOGDATA 0A Set A LOGDATA 1A LOGDATA 1A KEY B KEY B LOGDATA 0B LOGDATA 0B Set B LOGDATA 1B LOGDATA 1B The keys and logdata are predefined by Philips Semiconductors by means of defined Transport Keys (both keys show the same bit map) and Transport Logdata (all logdata show the same bit map), see also chapter "Configuration of Delivered HITAG 1 Transponders". They can be written to, which means that they can be changed. ATTENTION: Keys and Logdata only can be changed if their current values are known!
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
6 Quality Inspection
Quality inspection is performed with statistical quality control according to ISO 2859 part 1, with AQL1.0.
Optical Properties scratches, according to the reference sample encapsulation failures, catalogue gold discolouration, delamination measured with gauge measured with gauge measured with micrometer at the center of the glob top basic read/write operations
Geometrical Properies width length overall thickness Electrical Properties Shipment Quantity Packing and Labeling operation
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
7 Characterisation and Test of the Final Transponder
7.1 Characterisation of the Transponder
The parameters recommended to be characterised for the transponder are:
Parameter Resonant frequency Threshold value Threshold value for READ f res BTH BRD Comment Transponder does not modulate Resonant frequency @ Tamb = 22C, @ BTH Start of modulation Command READ_PAGE OK Command WRITE_PAGE OK
Threshold value for WRITE BWR
For the measurement of these parameters we recommend to use the test equipment available from SCEMTEC, Marienheide-Rodt, Germany (Transponder Measurement System STM-1). This device also supports functional testing (besides parameter testing). Therefore it can also be used as production test equipment for the final transponder test. For further information please contact Scemtec GmbH.
7.2 Final Test of the Transponder
In addition to the equipment described in the previous chapter Philips Semiconductors offers a device for a final functional test of transponders, the HITAGTM Test System HT OT490. Parameter tests are not supportet by this device. Basic flow for production and test: 1. Assembly of transponders 2. Functional test and final test of the EEPROM Since the Keys and Logdata are changed during final test the Configuration and personalization must take place after the final test. The final test is disabled (not reversible) by setting the Tag-test mode bit to 0.
For the final test of transponders we recommend to use the HITAGTM Test System HT OT490 of Philips Semiconductors or the Transponder Measurement System STM-1 of Scemtec.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
8 Ordering Information
Type Name HT1 MOA3 S30/E/3 HT1 MOA3 S30/E/1 Description HITAG 1 S30 Chip Module, reels HITAG 1 S30 Chip Module, bulk Ordering Number 9352 600 61118
9352 602 18122
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
Definitions
Data sheet status Objective specification This data sheet conta ins ta rget o r goal spec ifications for product deve lopment. Preliminary specification This data sheet conta ins p reliminary data; supp lementary data may be pub lished later. Product spec ification Limiting values Limiting va lues g iven are in acco rdance with the Abso lute Maximum Rating Syste m (IEC 134). Stress above one o r more of the limiting va lues may cause pe rmanent da mage to the dev ice. These are stress ratings on ly and ope ration of the dev ice at these o r at any othe r cond itions above those g iven in the Characteristics sect ion of the spec ification is not implied. Exposu re to limiting va lues for extended pe riods may aff ect dev ice reliab ility. Application information Where application information is given, it is adv isory and does not form part of the spec ification. This data sheet conta ins final product spec ifications.
Life support applications
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so on their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such improper use or sale.
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Specifications of the HT1 MOA3 S30
Rev. 1.1
1997-08-19
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTHRYDE, NSW 2113, Tel. +612 9805 4455, Fax. +612 9805 4466 Austria: Computerstrae 6, A-1101 WIEN, P.O.Box 213, Tel. +431 60 101, Fax. +431 30 101 1210 Belarus: Hotel Minsk Business Centre, Bld. 3, r.1211, Volodarski Str. 6, 220050 MINSK, Tel. +375172 200 733, Fax. +375172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA Tel. +3592 689 211, Fax. +3592 689 102 Canada: Philips Semiconductors/Components, Tel. +1800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +85223 19 7888, Fax. +85223 19 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +4532 88 2636, Fax. +4531 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +3589 61 5800, Fax. +3589 61 580/xxx France: 4 Rue du Port-aux-Vins, BP 317, 92156 SURESNES Cedex, Tel. +331 40 99 6161, Fax. +331 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +4940 23 53 60, Fax. +4940 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +301 4894 339/239, Fax. +301 4814 240 Hungary: see Austria India: Philips INDIA Ltd., Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400018, Tel. +9122 4938 541, Fax. +9122 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +3531 7640 000, Fax. +3531 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St., TEL AVIV 61180, Tel. +9723 645 0444, Fax. +9723 649 1007 Italy: Philips Semiconductors, Piazza IV Novembre 3, 20124 MILANO, Tel. +392 6752 2531, Fax. +392 6752 2557 Japan: Philips Bldg. 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +813 3740 5130,Fax. +813 3740 5077 Korea: Philips House, 260-199, Itaewon-dong, Yonsan-ku, SEOUL, Tel. +822 709 1412, Fax. +822 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, Selangor, Tel. +60 3750 5214, Fax. +603 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, Texas 79905, Tel. +9 5800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +3140 27 82785, Fax +3140 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +649 849 4160, Fax. +649 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +4722 74 8000, Fax. +4722 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O.Box 2108 MCC, MAKATI, Metro MANILA, Tel. +632 816 6380, Fax. +632 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZWA, Tel. +4822 612 2831, Fax. +4822 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7095 247 9145, Fax. +7095 247 9144 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65350 2538, Fax. +65251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. Philips Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O.Box 7430 Johannesburg 2000, Tel. +2711 470 5911, Fax. +2711 470 5494 South America: Al. Vicente Pinzon, 173 - 6th floor, 04547-130 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +5511 821 2333, Fax. +5511 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +343 301 6312, Fax. +343 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +468 632 2000, Fax. +468 632 2745 Switzerland: Allmendstrae 140, CH-8027 ZURICH, Tel. +411 488 2686, Fax. +411 481 7730 Taiwan: Philips Taiwan Ltd., 2330F, 66, Chung Hsiao West Road, Sec. 1, P.O.Box 22978, TAIPEI 100, Tel. +8862 382 4443, Fax. +8862 382 4444 Thailand: Philips Electronics (Thailand) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +662 745 4090, Fax. +662 398 0793 Turkey: Talapasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90212 279 2770, Fax. +90212 282 6707 Ukraine: Philips Ukraine, 4 Patrice Lumumba Str., Building B, Floor 7, 252042 KIEV, Tel. +38044 264 2776, Fax. +38044 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UM3 5BX, Tel. +44181 730 5000, Fax. +44181 754 8421 United States: 811 Argues Avenue, SUNNYVALE, CA94088-3409, Tel. +1800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: Philips, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +38111 625 344, Fax. +38111 635 777
Philips Semiconductors, Mikron-Weg 1, A-8101 Gratkorn, Austria Fax: +43 / 3124 / 299 - 270
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O.Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax: +3140 27 24825 (c) Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without any notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Internet: http://www.semiconductors.philips.com
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